Most modern systems and solutions need both Hardware and Software expertise. Baegan has got the right expertise in both sides of the isle. We work closely with our customers in every stage of the product design and production cycle to give the best possible solutions, unparalleled in the Industry

The systems and solutions that we develop for our customers are state of the art in terms of technology used. Our expertise includes hardware technologies of ASIC's,FPGA ,CPLD and PLC

FPGA

Our customers in this market are Embedded System Players and ASIC developers. Typical design implementations are Glue logic and Digital IP’s. Functional verification is another area of application. Our solutions are either implemented in CPLD's or FPGA’s or ASIC's. Typically, our customers request the best cost effective solutions

The following table gives the list of solutions that we have implemented. The solutions were either in  CPLD's  or FPGA's or ASIC's 

Click

Sl No	Title of IP/Glue Logic – Either FPGA or CPLD or ASIC Implemented	Description
1	Reed–Solomon Decoder	Introduction in FEC (Forward Error Correction) algorithms – VHDL design and verification of Key-Equation solver block with different algorithms (Berlekamp-Massey and Euclidean Algorithm) using composite Galois Fields GF((2r)s) – Coding of C/C++ models for verification and debugging – Timing optimization and synthesis for XILINX FPGA
2	Design of MHL (Mobile High-Definition Link) link	The MHL is a new mobile audio/video interface standard for directly connecting mobile phones to high-definition televisions (HDTVs). The MHL features a single-cable with a low pin-count interface able to support up to 1080p high-definition (HD) video and digital audio while simultaneously charging the connected device. The design specification for the Digital part of MHL developed
3	Design / Verification of digital part of custom ASIC (Mixed Signal Ultra Low Power CPU) for Mobile phones	Development and Verification of digital periphery blocks
4	Requirement specification setup for next generation automotive power-train applications	Writing requirement specification for new module IP s (µs Bus and MPI-Multi Processor Interface) –  Writing FTS-Functional Target Specification for µs Bus and MPI interface using Framemaker – Investigation of  use cases  for each requirement for automotive purpose
5	Test environment / test cases for UNIPRO	UNIPRO is a high-speed interface technology for interconnecting integrated circuits in mobile phones or comparable products. Layer 2, (Data Link), functionality is single-hop reliability and priority based arbitration. Test Environment and Test cases for Layer 2 was developed and implemented
6	PUB (Parallel to USB Interface)	This is a Board Level Solution, dedicated to interface parallel Printer Port and USB (1.1) device/computer. A microcontroller was used to interface the PPC (parallel port controller) and USB Host controller (Cypress)
7	Design of monitor circuit for a spectral photometer	A board developed for sensor electronics which receives analog signal from Photodiode, the microcontroller processes this signal and sends it into LabView program running in PC.
8	MOST Data Link Layer	Coding of three blocks for MOST Data Link Layer in SystemC – SystemC coding for debugging and verification environment, verification
9	Printer head data controller for Dot matrix printer	A CPLD was implemented for controlling 9 Wire Printer Head Data and CR Motor. By placing this CPLD in the existing MLC board, overall performance and speed of printer was increased
10	Digital Dash Board	The purpose of this Digital Dashboard is to display Analog parameters like Speed, Distance travelled, Fuel level and also Real time clock indicators by using Static and Dynamic LCDs
11	Microcontroller with MIPS R3000 Core for Automotive purposes	ADC Controller functional and design specification setup - ADC Controller RTL designing in Verilog - ADC FSM (Finite State Machine) and ADC Top Level designing with Mentor Graphics HDL Designer - Scripts setup, constraining and synthesis of ADC Controller, UART, SPI and CAN modules - Script setup and constraining for functional and SCAN mode of operation for STA (Primetime)

Click

At Baegan we Design, Develop and mass Produce ASIC’s (Chips) targeting markets of Power, Industrial, Automobile and Communication. Typical customers are Embedded System Developers and full system, discrete type, PCB solution providers. We design chips for the Indian Market as of now. Our customers are mostly Indian’s – But things could change in the near future

Depending on Design, the chips designed by us are classified into Analog, Digital or Mixed-Signal Chips. Depending on the complexity, the chips are completely designed and produced by Baegan or developed with our partners

If you have a Chip Design in mind and you are new to the Chip Industry, we advise you to get familiar with the Design and Production cycle. Know our Chip Design Process Click

Production and Packaging is done in Germany and Taiwan. Depending upon your system requirements, any type of packaging is possible. Designs with MCM (Multi-Chip Modules) have been designed.

In terms of volume, 10k chips to even 10 Million are possible. Obviously, greater the volume, the lesser is the price/chip. Only Silicon Data, only MPW runs, only Wafers and Packaged Chips are possible as outputs – depending upon your requirements 

Interested? Get in touch with our experts  here, to see if your need, can be profitably, be converted into chips

Click

For the Indian Market we have come-up with a Product X ( name withheld for IP reasons).The design involves several discipline of Engineering namely Electrical, Mechanical, Power and Micro Electronics

Feasibility starts Q1 2011. At end of this study we will have the “Product Document” and “Financial Feasibility”

Product Document - Details include but not limited to Specification of the product, Design procedure, Software's used, Skill-set required, Production information

Financial Feasibility - Details include but not limited to Design Cost, Production Cost, Market & Investor information

Product Y(name withheld for IP reasons) for Industrial customers all over the world. The product improves production and is for production facilities. It involves the discipline of Automation Technology. Feasibility starts summer 2011. Preparation work going on

We hope to team up with a German production supplier for the design. If need be we would have to team up with German University for the small amount of research work needed

At Baegan, we provide opportunity for students who do their master thesis or project work in the field of VLSI & IT technologies. By teaming up with Baegan for their thesis work

• an opportunity to get an insight into technologies that are used in the Semiconductor business
• an opportunity to learn how technology is used to solve real world problems - giving solutions to customers, people and communities that we serve.
• an opportunity to develop their carriers and of course know about Baegan and our culture

Application Areas